Multi-beam laser sensor for semiconductor lead measurements
AssigneeCyberOptics Corporation
InventorsDavid Fishbaine, John P. Konicek, Steven K. Case, Timothy A. Skunes, Jeffrey A. Jalkio
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AssigneeCyberOptics Corporation
InventorsDavid Fishbaine, John P. Konicek, Steven K. Case, Timothy A. Skunes, Jeffrey A. Jalkio
Estimating the term…
A high speed, high precision laser-based semiconductor lead measurement system for use on surface mount component placement machines. A multi-beam laser system is used to accurately sense the position and condition of each of the many leads used on integrated circuits prior to their placement on a surface mount circuit board by a pick and place machine. Using two, three or four laser beams, the non-contact sensor system can, with the highest degree of resolution, determine lateral orientation, height, colinearity, and coplanarity of leads for integrated circuit components, even those having an ultra-fine pitch. Determination of the lead position by the invention is based on the integrated circuit leads occluding the light of one or more precisely directed and focused laser light sources. Each integrated circuit lead is passed nominally through the focal point of a laser beam. The position of each lead is determined when it blocks all or a portion of the light of the laser beam. A processor means is used to calculate the actual position of each lead. The difference between the actual position of the lead and the nominal position of the lead can then be computed. The position of each lead is then sorted to determine the greatest deviation of any lead from a best fit line or from the Seating Plane. The processor may then either generate a reject or a repositioning signal to the component placement machine for proper placement of the integrated circuit upon the surface mount circuit board.
A multi-beam sensor for determining the height of each element of a multiple element device of the type having each of its elements nominally disposed in a single horizontal plane, wherein the multiple element device is in motion relative to the multi-beam sensor, the multi-beam sensor comprising:
A multi-beam sensor for determining the height of each element of a multiple element device of the type having each of its elements nominally disposed in a single horizontal plane, wherein the multiple element device is in relative motion so that each element has a leading edge and a trailing edge, the multi-beam sensor comprising:
A four beam sensor for determining the height of each element of a multiple element device of the type having each of its elements nominally disposed in a single horizontal plane, wherein the multiple element device is in motion relative to the four beam sensor, the four beam sensor comprising:
A method for determining the height, from a horizontal reference plane, of the lower surface of a lead on a multiple lead device and for determining whether the lead height is within an acceptable height deviation, the method comprising:
A method for determining the height of each element of a multiple element device of the type having each of its elements nominally disposed in a single horizontal plane, wherein the multiple element device is in relative motion and each element has a leading edge and a trailing edge, the method comprising:
Dependencies are inferred from the claim text.