Electrode forming apparatus
AssigneeMurata Manufacturing Co., Ltd.
InventorsTadahiro Nakagawa, Shizuma Tazuke, Mitsuro Hamuro, Hirokazu Higuchi, Katsuyuki Moriyasu, Akihiko Takahashi
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AssigneeMurata Manufacturing Co., Ltd.
InventorsTadahiro Nakagawa, Shizuma Tazuke, Mitsuro Hamuro, Hirokazu Higuchi, Katsuyuki Moriyasu, Akihiko Takahashi
Estimating the term…
An electrode forming apparatus comprises a recovery blade for collecting electrode paste on the bottom surface of a dipping vessel toward a first end of the dipping vessel and a levelling blade for levelling the electrode paste, being collected toward the first end, toward a second end of the dipping vessel for adjusting the same to a constant film thickness. The recovery blade and the levelling blade are supported by a blade support frame, which is horizontally reciprocated with respect to the dipping vessel. The recovery blade is vertically moved by a cylinder, while the vertical position of the levelling blade is finely controlled by a levelling control motor. Thus, the film thickness of the electrode paste can be accurately adjusted with excellent repeatability, thereby carrying out homogeneous electrode application.
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising:
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising:
An apparatus for forming a layer of electrode paste on a bottom surface of a dipping vessel for applying electrodes onto ends of chip type electronic components, said apparatus comprising:
Dependencies are inferred from the claim text.