Semiconductor memory device and method for producing it
AssigneeSony Corporation
InventorsHideharu Nakajima, Hideaki Kuroda
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AssigneeSony Corporation
InventorsHideharu Nakajima, Hideaki Kuroda
Estimating the term…
In a semiconductor memory device, a first sidewall and a second sidewall are formed simultaneously for a memory cell section and a peripheral circuit section, and a high impurity concentration region is formed by being delimited by the second sidewall in the memory cell section, while a high impurity concentration section is formed by being delimited by the first sidewall in the peripheral circuit section. In this manner, MOS transistors having different LDD widths of the low impurity concentration regions and hence different characteristics, in which the MOS transistor of the memory cell section has improved voltage withstand properties and the MOS transistor of the peripheral circuit section has improved current driving capabilities, may be formed on the same substrate.
A semiconductor memory device in which a memory cell section and a peripheral circuit section are formed on one and the same substrate and in which the source regions and the drain regions of MOS transistors of said memory cell section and the peripheral circuit section consist in high concentration impurity regions and low concentration impurity regions, characterized in that
A method for producing a semiconductor memory device in which a memory cell section and a peripheral circuit section are formed on one and the same substrate and in which the source regions and the drain regions of MOS transistors of said memory cell section and the peripheral circuit section consist of high concentration impurity regions and low concentration impurity regions, comprising the steps of
Dependencies are inferred from the claim text.