US 5,329,154 A · Compound semiconductor integrated circuit having improved electrode bonding arrangements

Abstract

An integrated circuit including a wafer having a GaAs substrate, an un-doped GaAs layer, and a GaAs active layer. This active layer may have an HEMT structure to improve its operation speed. Also, the substrate may a multi-layer structure to form a three dimensional capacitor. At least one mesa portion is formed on the substrate by removing a portion of the un-doped GaAs layer and GaAs active layer. A source electrode, for example, is formed on the mesa portion, and a ground electrode is formed on an exposed surface of the substrate. These electrodes are connected to each other by means of a wiring metal layer. As a result, the source electrode is easily grounded without using a long bonding wire.

Claims4

Dependent claims

A compound semiconductor integrated circuit, comprising:

a compound semiconductor substrate;
a buffer layer having a high resistivity which is formed on said substrate;
an active layer formed on said buffer layer;
an ohmic electrode which is formed on an exposed surface portion of said substrate, the exposed surface portion being formed by opening a hole through said buffer layer and said active layer;
device electrodes formed on said active layer;
and
a wiring metal layer which connects said ohmic electrode with at least one of said device electrodes, wherein said substrate is made of n.sup.+ type GaAs, said buffer layer is made of un-doped GaAs, and said active layer is made of n type GaAs.

4 more elements

Dependencies are inferred from the claim text.

Compound semiconductor integrated circuit having improved electrode bonding arrangements

Life of this patent

Compound semiconductor integrated circuit having improved electrode bonding arrangements

Life of this patent

Abstract

Claims4