Thermoplastic copolyimides and composites therefrom
AssigneeThe University of Akron
InventorsFrank Harris, Patricia A. Gabori
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AssigneeThe University of Akron
InventorsFrank Harris, Patricia A. Gabori
Estimating the term…
Copolyimide compositions and methods for their preparation which are melt-processible at relative low pressures, i.e. less than 1000 psi, and are suited for laminating and molding, are described. The invention additionally encompasses copolyimide precursors, reinforced polyimide composites and laminates made from said polyimides where the composite is reinforced by fibrous materials. This is achieved by reacting at least one aromatic dianhydride where each anhydride group is located on an aromatic ring with the carbonyl units in an ortho orientation relative to one another, with at least one diamine which is capable of a transmidization reaction upon incorporation into the polyimide backbone, and with at least one other diamine which is not capable of undergoing such reaction, the diamine which is capable of undergoing the transimidization reaction being present in an amount of from about 1-50 mole percent in relation to the diamine that is not susceptable to transimidization.
A process for improving the melt processibility of a thermoplastic copolyimide comprising the steps of:
A process for improving the melt processibility of a thermoplastic copolyimide comprising the steps of:
A process for improving the melt processibility of a thermoplastic copolyimide having comprising the steps of:
A thermoplastic copolyimide melt-processible at a pressure less than or equal to 250 psi, comprising:
A thermoplastic copolyimide having a T.sub.g greater than 300.degree. C., melt-processible at a pressure less than or equal to 250 psi, comprising:
Dependencies are inferred from the claim text.