Positive image formation utilizing radiation sensitive mixture containing dimeric or trimeric sesamol/aldehyde condensation products as sensitivity enhancers

The process of developing an image-wise exposed photoresist-coated substrate comprising:

• (a) coating said substrate with a radiation-sensitive composition useful as a photoresist, said composition comprising an admixture in a solvent of:
• at least one alkali-soluble binder resin, at least one photoactive compound and an effective sensitivity enhancing amount of at least one dimeric or trimeric unit formed by the condensation reaction of an aldehyde with sesamol;
• the amount of said binder resin being about 60 to 95% by weight, the amount of said photoactive component being about 5% to about 40% by weight, based on the total solids content of said radiation-sensitive composition;
• (b) subjecting said coating on said substrate to an image-wise exposure of radiant light energy;
• and
• (c) subjecting said image-wise exposed coated substrate to a developing solution to remove the image-wise exposed areas and form a positive image-wise pattern in the coating.