Scanning laser lithography system alignment apparatus

An apparatus for direct writing to a substrate, comprising:

• (a) writing means for writing directly to said substrate, said writing means having a first radiant energy source for producing a first radiant energy beam, said first radiant energy beam being directed to said substrate for producing devices thereon;
• (b) beam reduction means for reducing the diameter of said energy beam, said beam radiation means optically coupled with said writing means;
• (c) viewing means for viewing a reflected image of said substrate, said viewing means optically coupled to view said image through said beam reduction means.

An alignment apparatus for a system for writing to a photosensitive substrate comprising:

• (a) a radiant energy source producing a radiant energy beam;
• (b) first means for directing said radiant energy beam over a first optical path to said substrate and for receiving from said substrate a reflection of said beam, said first means producing an image of a relatively low magnification;
• (c) second means for directing said radiant energy beam over a second optical path to said substrate and for receiving from said substrate a reflection of said beam, said second means producing an image of a relatively higher magnification than produced by said first means.

An alignment apparatus for a system for writing to a photosensitive substrate comprising:

• (a) a radiant energy source producing a radiant energy beam;
• (b) first means for directing said radiant energy beam over a first optical path to said substrate and for receiving from said substrate a specular reflection of said beam, said first means producing a bright field image;
• (c) second means for directing said radiant energy beam over a second optical path to said substrate and for receiving from said substrate a scattered reflection of said beam, said second means producing a dark field image.

A semiconductor substrate, said substrate providing area for formation of circuits thereon by processing equipment, said substrate requiring alignment with said processing equipment during formation of said circuits, said substrate having thereon a registration mark for aligning said substrate, said registration mark comprising:

• a registration mark area;
• a plurality of markings aligned to provide symmetrical non-periodic spacing of said markings within said registration area.

A direct-write multiple radiant energy beam lithography system for writing to a substrate, comprising:

• (a) writing means for writing directly to said substrate, said writing means having a first radiant energy source for producing a first plurality of radiant energy beams, said first plurality of radiant energy beams for scanning said substrate to effect said writing;
• and
• (b) alignment means for aligning said substrate with said radiant energy beams, said alignment means illuminating said substrate using full-field imaging to substantially illuminate the entire surface of said substrate.