US 5,323,532 AGranted

Method for providing novel hybrid circuit assembly carrier bracket

AssigneeMotorola, Inc.

InventorsDetlef W. Schmidt, John Lubbe

Life of this patent

Estimating the term…

Loading patent…

Abstract

An apparatus and method (200) for providing a hybrid circuit assembly carrier bracket are included wherein the bracket is constructed and arranged to provide controlled placement of at least a first power transistor (124, 126) and to provide a highly efficient thermal transfer and dissipating arrangement. The bracket is constructed and arranged to provide for placement of at least a first substrate for a hybrid circuit assembly thereon, and includes at least a first power transistor aperture (120, 122) with at least two bracket projections (146, 148) for permitting placement of said transistor on plural electrical contacts (104, 106). The heat generated by components on the circuit board(s) is transferred and dissipated substantially by biasing at least one bracket projection member resiliently against a heat sink (108, 110, 112, 114, 116, 118).

Claims5

Dependent claims

A method for forming a carrier bracket for at least a first substrate for a first hybrid circuit assembly having transistor contact areas and at least a first power transistor that has at least a bottom flange and a plurality of leads, comprising the steps of:

providing a substantially planar conductive support sheet,
providing at least a first heat transfer tab derived from the support sheet for providing heat sinking capability,
positioning at least a first hybrid circuit assembly on the support sheet, and
providing at least a first aperture in the support sheet for guiding placement of the bottom flange of the transistor such that the transistor occupies the aperture, provides heat sinking capability and permits suspension of the transistor from, and solderable connection to transistor contact areas of the assembly utilizing the transistor leads, and providing at least a first substrate stop defined by an exposed portion on the support sheet for securing placement of at least the first hybrid circuit assembly onto the support sheet and wherein the substrate stop is formed by one of:
(a) the substrate is press-formed from the planar conductive support sheet,
(b) the substrate stop is formed by bending the planar conductive support sheet, and
(c) the substrate stop is shaped by an aperture in the planar conductive support sheet and is positioned by providing a bend at the base of the substrate stop such that the stop projects above the plane of the planar conductive support sheet.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/003,332Filed 12 Jan 1993 · division
Priority: 31 Jan 1992
Granted: 28 Jun 1994
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H10W 90/00
Package configurations
Y10T 29/49121
Conductor or circuit manufacturing: beam lead frame or beam lead device
Y10T 29/4913
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.
H10W
Generic packages, interconnections, connectors or other constructional details of devices covered by