Method for selective removal of organometallic and organosilicon residues and damaged oxides using anhydrous ammonium fluoride solution

A method for selectively removing organometallic residues, organosilicon residues, native silicon oxides, or damaged silicon oxides created in processing a semiconductor substrate from said semiconductor substrate, comprising contacting said semiconductor substrate with an etching solution for a time sufficient to remove said organometallic residues, organosilicon residues, native silicon oxides, or damaged silicon oxides from said semiconductor substrate, wherein

• (a) said etching solution comprises an anhydrous ammonium fluoride salt dissolved in a polyhydric alcohol, said anhydrous ammonium fluoride salt selected from the group consisting of anhydrous ammonium fluoride and anhydrous ammonium bifluoride and mixtures thereof, and
• (b) said etching solution contains less than about 4% by weight water and is free of added hydrogen fluoride.