Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition

A temperature limiting mounting assembly for an electronic component that generates heat when operated, comprising:

• a thermally conductive heat sink configured to have an electronic component mounted on it in direct thermal contact with the heat sink, said heat sink dissipating heat from an electrical component mounted thereon;
• and
• a mass of a heat absorbing material in direct contact with said heat sink for absorbing heat from and limiting the temperature of said heat sink to a predetermined temperature, said heat absorbing mass having a lower thermal conductivity than said heat sink, with said heat sink interfacing between said heat absorbing mass and an electronic component mounted on the heat sink, said heat absorbing means including a solid material which exhibits an isothermal solid-solid phase transition at approximately said predetermined temperature, and limiting the temperature of an electronic component mounted on said heat sink to approximately said predetermined temperature through thermal conduction through said heat sink to said heat absorbing mass.