Transistor structure utilizing a deposited epitaxial base region
AssigneeInternational Business Machines Corporation
InventorsChang-Ming Hsieh, Louis L. Hsu, Victor J. Silvestri
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AssigneeInternational Business Machines Corporation
InventorsChang-Ming Hsieh, Louis L. Hsu, Victor J. Silvestri
Estimating the term…
A method of fabricating a semiconductor structure, comprising the steps of: providing a monocrystalline semiconductor device region of a first conductivity type; forming a layer of intrinsic monocrystalline semiconductor material over the device region; forming a layer of insulating material over the layer of intrinsic monocrystalline semiconductor material; forming a conductive contact over a portion of the layer of insulating material; forming an aperture extending through the conductive contact, and the layers of insulating material and intrinsic monocrystalline semiconductor material to define an aperture exposing a selected portion of the layer of intrinsic monocrystalline semiconductor material; and forming a layer of semiconductor material of a second conductivity type including a monocrystalline portion disposed epitaxially over the device region portion and a polycrystalline portion extending onto the wall of the conductive contact within the aperture.
A buried emitter bipolar transistor comprising:
A buried emitter bipolar transistor comprising:
A buried emitter bipolar transistor comprising:
A buried emitter Schottky Barrier Collector transistor comprising:
Dependencies are inferred from the claim text.