Leadless ceramic package with improved solderabilty
AssigneeKyocera America, Inc.
InventorsTaka Irie, Aki Nomura
Life of this patent
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Abstract
A method of fabricating a leadless ceramic package having improved solderability characteristics. The ceramic packages are singulated from the package array before electroplating. This eliminates the damage which may occur to the plating layer during singulation, and permits plating of base metal exposed by singulation. Furthermore, the plating solution is not required to penetrate small-diameter castellation holes, which would often result in incomplete electroplating of the castellation surfaces.
Claims11
A method of fabricating at least one ceramic package, comprising the steps of:
- (1) forming from an array of packages at least one individual ceramic package having castellations including electrically conductive traces formed of base metal;
- (2) attaching at least one electrically-conductive tie-bar to each said individual ceramic package;
- (3) electroplating at least one metal layer on exposed base metal conductive traces of each said individual ceramic package;
- and
- (4) removing each said tie-bar from each said individual ceramic package.
A method of fabricating at least one ceramic package, comprising the steps of:
- (1) forming an array comprising a plurality of attached individual ceramic packages, each including electrically conductive traces formed of base metal;
- (2) co-firing the ceramic packages;
- (3) singulating individual ceramic packages from the array;
- (4) attaching at least one electrically-conductive tie-bar to at least one singulated package;
- (5) electroplating at least one metal layer on exposed base metal conductive traces of the at least one singulated ceramic package;
- and
- (6) removing each said tie-bar from the at least one individual ceramic package.
Dependencies are inferred from the claim text.