Automatic lead frame feeding device for a TO-220 semiconductor manufacturing apparatus
AssigneeGold Star Electron Co., Ltd.
InventorYoul Kim
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AssigneeGold Star Electron Co., Ltd.
InventorYoul Kim
Estimating the term…
This invention relates to an automatic lead frame feeding device for a TO-220 semiconductor manufacturing apparatus, which automatically feeds lead frames to die bonding and wire bonding processes for manufacturing TO-220 semiconductor packages, and has an object to provide an automatic lead frame feeding device which can load large quantities of lead frames at a time without using a separate magazine for loading them, and then feed automatically them accurately one by one. To this end, the feeding device includes a loading section including a pair of guide members disposed in spaced opposite relation to each other to stack up lead frames therebetween, a transferring section disposed at one side of the loading section for transverse movement to drop one by one the stacked lead frames in the loading section in sequence beginning with the lowermost lead frame, and a feeding section positioned to feed the dropped lead frame in the loading section to a subsequent process.
An automatic lead frame feeding device for a TO-220 semiconductor manufacturing apparatus in which the lead frame includes four sides, two of said sides being parallel and the remaining two of said sides forming a perimeter with the two parallel sides, the feeding device comprising:
Dependencies are inferred from the claim text.