Package for a high power electrical component

A package for a high power electrical component, comprising:

• a base formed of a material having a coefficient of thermal expansion of a first magnitude and including a support surface;
• a plate including an electrically insulative layer and first and second outer layers disposed on opposite faces of the electrically insulative layer wherein the first outer layer is disposed on the support surface and the second outer layer includes an electrically conductive portion and wherein the plate has a coefficient of thermal expansion greater than the first magnitude;
• an electrically conductive pad disposed on the electrically conductive portion of the second outer layer so that electrical contact is established therebetween wherein the pad has a coefficient of thermal expansion less than the coefficient of thermal expansion of the plate;
• wherein the electrical component is disposed on the pad and includes a first electrode in electrical contact with the pad and a second electrode;
• a cover disposed on the base and enclosing the plate, the pad and the electrical component, the cover being formed of a material having a coefficient of thermal expansion substantially equal to the first magnitude;
• first and second electrically conductive terminals extending through first and second apertures in the cover, the first terminal being electrically coupled to the first electrode of the electrical component through the conductive pad and the electrically conductive portion of the second layer of the plate and the second terminal being electrically coupled to the second electrode;
• and
• means for hermetically sealing the cover to the base and for hermetically sealing the first and second terminals to the first and second apertures, respectively.