Apparatus for optimally scanning a two-dimensional surface of one or more objects
AssigneeHughes Aircraft Company
InventorSherman Poultney
Life of this patent
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Abstract
An apparatus for optimally scanning a surface of one or more semiconductor wafers undergoing a chemical etching process, comprising: (a) means for registering the semiconductor wafers to a wafer retention stage; and (b) means for controlling a spiral pattern movement of a spiral type scan of the surface of the semiconductor wafers by the chemical etching instrument probe, whereby the surface is figured to correspond to a desired thickness.
Claims8
An apparatus for optimally scanning a surface of one or more semiconductor wafers undergoing a chemical etching process using a chemical etching instrument probe, said apparatus comprising;
- means for registering said one or more semiconductor wafers to a wafer retention stage;
- and
- means for controlling a spiral pattern movement of a spiral type scan of said surface of one or more semiconductor wafers by said chemical etching instrument probe, whereby said surface is figured to correspond to a desired thickness.
An apparatus for optimally scanning a surface of one or more semiconductor wafers undergoing a chemical etching process using a chemical etching instrument probe, said apparatus comprising;
- means for registering said one or more semiconductor wafers to a wafer retention stage;
- means for controlling a boustrophedon type scan of said surface of one or more semiconductor wafers by said chemical etching instrument probe;
- and
- means for modulating a chemical etching rate of said chemical etching instrument probe, whereby said surface is figured to correspond to a desired thickness.
Dependencies are inferred from the claim text.