Electronic assembly with improved grounding and EMI shielding

An electronic assembly comprising:

• a first electronic component having a pin;
• a second electronic component a coupled to the first electronic component, the second electronic component having a chassis and a hole through which the pin extends;
• a grounding clip secured to the second electronic component comprising:
• a base having an opening sized to accept the pin;
• a pin contact extending from the base, the pin contact sized and positioned to contact the pin when the first and second components are coupled;
• and
• a resilient arm extending from the base in a direction at an acute angle to the pin, the arm sized and configured to engage the chassis thereby electrically connecting the grounding clip to the chassis.

An electronic assembly with EMI shielding comprising:

• a backplane;
• an electronic module including a chassis;
• module and backplane interface connectors electrically coupling the electronic module and the backplane when the electronic module is at an engaged position relative to the backplane;
• the backplane including a backplane ground plane and an exposed, elongated ground pad substantially circumscribing the interface connectors and facing the electronic module, the ground pad and the backplane ground plane electrically connected to one another, the ground pad having a length;
• conductive means for electrically coupling substantially the entire length of the elongated ground pad to the chassis so to crate an EMI shield including the chassis, the conductive coupling means, the ground pad and the backplane ground plane;
• a conductive alignment pin extending from the backplane and electrically connected to the backplane ground plane;
• a floatable chassis board floatably mounted within the chassis to accommodate proper alignment of the module and backplane interface connectors, the chassis board includes a chassis board ground plane;
• module interface connector being mounted to the chassis board;
• a grounding clip mounted to the chassis board for electrical engagement with the alignment pin when the electronic module is at the engaged position, the grounding clip being electrically connected to the chassis board ground plane;
• the grounding clip including a resilient arm extending laterally relative to the alignment pin and sized to engage the chassis to provide electrical connection from the alignment pin to the chassis regardless of the position of the floatable chassis board.