Low profile header assembly for an encapsulated instrument
AssigneeGEC-Marconi Electronic Systems Corp.
InventorsCharles R. Fuchs, Gerald J. Gorman, Peter Lindsay
Life of this patent
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Abstract
A low profile header assembly for an encapsulated instrument includes a plate member with a cavity which is on the side of the plate member external to the instrument. Terminal pins extend through the plate member both within the cavity and beyond its periphery. Hybrid amplifier circuitry is disposed within the cavity and electrically connected to the pins within the cavity. The cavity is hermetically sealed and the internal components of the instrument are electrically connected to the terminal pins within the instrument shell.
Claims6
In combination with an encapsulated instrument including a shell and components internal to said shell which require electrical connections external to said shell, a header assembly for capping said shell comprising:
- a plate member having first and second sides and a circumferential edge, said circumferential edge adapted for sealing to said shell with said first side external to said shell, said plate member being formed with a cavity open to said first side of said plate member, said second side of said plate member being generally planar;
- a plurality of first terminal members extending through said plate member from said first side to said second side and outside said cavity;
- a plurality of second terminal members extending through said plate member within said cavity;
- circuitry disposed within said cavity and electrically connected to said plurality of second terminal members within said cavity;
- sealing for sealing said cavity;
- and
- connecting means for providing electrical connections between said internal components of said instrument and said pluralities of first and second terminal members at said second side of said plate member.
Dependencies are inferred from the claim text.