Semiconductor device having a bi-level leadframe
AssigneeShinko Electric Industries Co., Ltd.
InventorsShinichi Wakabayashi, Akihiko Murata
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Abstract
A lead frame for a semiconductor device includes a resin base film having opposed surfaces and an opening therein. A plurality of inner leads are formed of a metal foil on one surface of the film in a desired inner lead circuit pattern that includes inner edges arranged for connection to a semiconductor device mounted on the film and outer edges positioned over the opening. A plurality of outer leads are formed of a metal sheet and adhered to the other surface of the film in a desired outer lead circuit pattern that includes inner edges positioned over the opening and outer edges that extend outwardly from the frame.
Claims4
A lead frame for a semiconductor device comprising:
- a resin base film having first and second surfaces and an opening therein;
- a plurality of inner leads positioned on said first surface of the film in a desired inner lead circuit pattern that includes a plurality of inner end portions arranged for connection to a semiconductor device mounted on the film and a plurality of outer end portions positioned at said opening;
- and
- a plurality of outer leads positioned on the second surface of the film in a desired outer lead circuit pattern that includes a plurality of inner end portions positioned at said opening and a plurality of outer end portions projecting outwardly of said frame, the outer end portions of said inner lead circuit pattern being electrically connected to corresponding inner end portions of said outer lead circuit pattern through said opening.
Dependencies are inferred from the claim text.