Laser-based semiconductor lead measurement system
AssigneeCyberOptics Corporation
InventorsJohn P. Konicek, Steven K. Case, Timothy A. Skunes, Jeffrey A. Jalkio
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AssigneeCyberOptics Corporation
InventorsJohn P. Konicek, Steven K. Case, Timothy A. Skunes, Jeffrey A. Jalkio
Estimating the term…
A high speed, high precision laser-based semiconductor lead measurement system for use on surface mount component placement machines. A laser system is used to accurately sense the position and condition of each of the many leads used on integrated circuits prior to their placement on a surface mount circuit board by a pick and place machine. Using one, two or three laser beams, the non-contact sensor system can, with the highest degree of resolution, determine lateral orientation and coplanarity of leads for integrated circuit components, even those having an ultra-fine pitch. Determination of the lead position by the invention is based on the integrated circuit leads occluding the light of one or more precisely directed and focused laser light sources. Each integrated circuit lead is passed through the focal point of a laser beam. The position of each lead is determined when it blocks all or a portion of the light of the laser beam. A processor means is used to calculate the actual position of each lead. The difference between the actual position of the lead and the nominal position of the lead can then be computed. The position of each lead is then sorted to determine the greatest deviation of any lead from a best fit plane. The processor may then either generate a reject or a repositioning signal to the component placement machine for proper placement of the integrated circuit upon the surface mount circuit board.
A sensor for determining the position of each element of a multiple element device of the type having each of its elements nominally disposed in a single plane, the sensor comprising:
A sensor for determining the position of each element of a multiple element device of the type having each of its elements nominally disposed in a single plane, the sensor comprising:
A sensor for determining the position of each element of a multiple element device of the type having each of its elements nominally disposed in a single plane, the sensor comprising:
A sensor for determining the position of each element of a multiple element device having each of its elements nominally disposed in a single plane, the sensor comprising:
A laser-based sensor for determining the lateral position of each lead on a multiple lead integrated circuit device having each lead nominally disposed in a single lateral plane, wherein the multiple lead integrated circuit device is transported by a quill through the sensor, the sensor comprising:
A laser-based sensor system for determining the lateral position of a lead on a multiple lead semiconductor device having each of its leads disposed in a single horizontal plane, the sensor system comprising:
A laser-based sensor system for determining the coplanarity of the leads on a multiple lead semiconductor device having each of its leads nominally disposed in a single horizontal plane, the sensor system comprising:
A laser-based sensor for determining the lateral position and coplanarity of the bottom surface of the leads on a multiple lead integrated circuit device, each lead being nominally disposed in a single lateral plane, the sensor comprising:
A laser-based sensor system for determining the lateral position and co-planarity of the lowest surfaces of the leads on a semiconductor component having multiple leads, each lead being disposed generally in a horizontal plane, the sensor comprising:
A two sensor system for determining the lateral position of each lead on a multiple lead component carried by a placement head on a component placement machine using the instantaneous position of the placement head, the two sensor system comprising:
A method for precisely placing a component with multiple leads carried by a surface mount component placement machine wherein the leads have a nominal lateral position, the method comprising:
A method of analyzing the leads on a component with multiple leads, the leads being nominally disposed in a single plane, the method comprising:
A method of determining the lateral position and coplanarity of the lower surfaces of leads on a multiple lead device, the method comprising:
A method for determining the position of each lead of a multiple lead integrated circuit device of the type having each of its leads nominally disposed in a single plane, wherein the multiple lead integrated circuit device is transported by a quill through a sensor, the method comprising:
A method wherein a plurality of light sources and at least two light detectors are positioned to detect whether light has been occluded by a leading edge of an element of the multiple element device and wherein detecting the leading edge of each element comprises receiving data from at least two light detectors for determining the position of each element of a multiple element device of the type having each of its elements nominally disposed in a single plane, the method comprising:
A method wherein a plurality of light sources and at least two light detectors are positioned to detect whether light has been occluded by a trailing edge of an element of a multiple element device and wherein detecting the trailing edge of each element comprises receiving data from at least two light detectors for determining the position of each element of a multiple element device of the type having each of its elements nominally disposed in a single plane, the method comprising:
A method for determining the position of each element of a multiple element device of the type having each of its elements nominally disposed in a single plane, the method comprising:
A method for determining the position of each element of a multiple element device of the type having each of its elements nominally disposed in a single plane, the method comprising:
A method for determining the exact width of each lead of a multiple lead integrated circuit device having each of its leads nominally disposed in a single plane, wherein the multiple lead integrated circuit device is transported by a quill through a sensor, the method comprising:
A sensor for determining the position of each element of a multiple element device of the type having each of its elements nominally disposed in a single plane, the sensor comprising:
Dependencies are inferred from the claim text.