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US 5,308,797 AGranted
Leads for semiconductor chip assembly and method
AssigneeTexas Instruments Incorporated
InventorDavid R. Kee
Life of this patent
Estimating the term…
Abstract
A semiconductor device is formed without using a leadframe. A semiconductor device is formed in one area of a semiconductor chip and a second area includes conductors to which lead wires are bonded. The lead wires are used for mounting the semiconductor device.
Claims10
A method of making a semiconductor device with leads formed directly on the semiconductor chip, comprising the steps of:
- forming a semiconductor device with bond pads thereon in a central conductive area of a semiconductor chip leaving a peripheral area of non-conductive semiconductor material that is electrically separate from the semiconductor device;
- forming a plurality of conductors on said non-conductive peripheral area around said centrally located semiconductor device, said conductors being electrically connected to said semiconductor device;
- bonding and forming a lead wire from a continuous wire feed source to each of said conductors;
- and
- cutting said formed lead wire to length.
2 more elements
A method of making a semiconductor device with leads formed directly on the semiconductor chip, comprising the steps of:
- forming a semiconductor device with bond pads thereon in a first conductive area of a semiconductor chip leaving a second non-conductive area of semiconductor material that is separate from the semiconductor device;
- forming a plurality of conductors on said second non-conductive area adjacent said first area, and electrically connecting them to the bond pads on said semiconductor device;
- electrically connecting and forming a lead wire to each conductor on said second area of said semiconductor chip;
- and
- encapsulating only the top surface of the device.
2 more elements
Dependencies are inferred from the claim text.