Positive image-forming process utilizing glass substrate with oxide film of indium-tin alloy, coated with o-quinonediazide photoresist, with etching of the oxide film in the imagewise exposed areas

An image-forming process which comprises (a) applying a positive-type photoresist onto a board comprising an oxide film of an indium-tin alloy provided on a base board of glass, (b) image-wise exposing, (c) developing with a developing solution to remove the image-wise exposed areas of the positive-type photoresist, and (d) etching the oxide film of the indium-tin alloy in the developed photoresist areas with an etching solution, wherein said positive-type photoresist substantially comprises:

• (A) an o-quinonediazide compound;
• (B) an alkali-soluble phenol resin;
• and
• (C) at least one compound selected from the group consisting of urea compounds, thiourea compounds, arylamine compounds represented by the general formulae (I), (II) and (III), respectively:
• ##STR5## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents a hydrogen atom, an alkyl group, an aryl group or any two of R.sub.1, R.sub.2, R.sub.3, and R.sub.4 form at least one ring together;
• ##STR6## wherein R.sub.5, R.sub.6, and R.sub.7 each represents a hydrogen atom, an alkyl group having from 1 to 8 carbon atoms, a hydroxyalkyl group having from 1 to 8 carbon atoms, a phenyl group unsubstituted or substituted with halogen atom(s), or a naphthyl group unsubstituted or substituted with halogen atom(s);
• and said component (C) is present in an amount of from 0.02 to 5.0% by weight based on the total solid content of components (A) and (B).