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US 5,308,463 AGranted
Preparation of a firm bond between copper layers and aluminum oxide ceramic without use of coupling agents
AssigneeHoechst Aktiengesellschaft
InventorsBernhard Hoffmann, Hartwig Gernoth
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Abstract
A process for preparing a firm bond between copper layers and aluminum oxide ceramic without coupling agent layers wherein the aluminum oxide ceramic is subjected to a plasma etching process in a first vacuum chamber in the presence of oxygen and immediately thereafter plated with copper by sputtering in a second vacuum chamber.
Claims13
A process for preparing a firm bond between a copper layer applied by sputtering and aluminum oxide ceramic, comprising the steps of:
- a) introducing the ceramic into a first vacuum chamber fitted with a plasma etching apparatus and evacuating the chamber down to 10.sup.-3 Pa;
- b) introducing oxygen into the chamber so that the chamber comes to an equilibrium pressure of from 0.1 to 3 Pa;
- c) striking a high frequency gas discharge above the ceramic, thereby plasma etching its surface;
- d) introducing immediately thereafter the plasma etched ceramic into a second vacuum chamber and plating the plasma etched surface with copper by sputtering.
1 more element
Dependencies are inferred from the claim text.