Apparatus and method for cooling heat generating electronic components in a cabinet

Apparatus for cooling electronic components within a cabinet of the type having air inlets and air outlets and an exhaust fan which creates a primary air flow across the components between the air inlets and air outlets in the cabinet and exhausts the air to the cabinet exterior, said apparatus comprising;

• an enclosure formed of electrically non-conductive material having an interior cavity configured to enclose at least one predetermined heat generating electronic component and isolate it from other electronic components in the cabinet,
• air inlet means on said enclosure connected with the air inlets of the cabinet and air outlet means on said enclosure connected with the air outlets of the cabinet and the exhaust fan, and
• said air inlet means, said enclosure, and said air outlet means defining a secondary air flow pathway from the air inlets of the cabinet across the enclosed heat generating electronic component to the air outlets and exhaust fan of the cabinet which is isolated from the primary air flow,
• the fan in operation creating the primary air flow across the non-isolated components between the air inlets and air outlets of the cabinet and exhausting the air to the cabinet exterior, and
• simultaneously creating a separate secondary air flow through said secondary air flow pathway across the enclosed heat generating electronic component between the air inlets and air outlets of the cabinet and exhausting the secondary air flow to the cabinet exterior, such that
• the non-isolated components and the enclosed heat generating electronic component are independently cooled by the primary air flow and said secondary air flow, respectively, and the heat generated by the enclosed heat generating electronic component and the non-isolated components is not mixed within the cabinet to maximize cooling of all components within the cabinet.

A cabinet for containing and cooling heat generating electronic components comprising;

• a cabinet housing having mounting means for mounting electronic components thereon and air inlets and air outlets for allowing air to pass through the cabinet interior in a primary air flow pathway across said mounting means.
• a plurality of electronic components including heat generating electronic components mounted on said mounting means:
• an exhaust fan connected with said housing inlets and outlets to create said primary air flow pathway across said mounting means and said components mounted thereon between said air inlets and air outlets in said cabinet housing and exhaust the air to the housing exterior;
• secondary air duct means in said cabinet housing configured to enclose at least one predetermined heat generating electronic component and isolate it from other components mounted therein and to connect said enclosed component in fluid communication with said air inlets, said air outlets, and said exhaust fan;
• said secondary air duct means isolated from said primary air flow pathway to define a separate secondary air flow pathway therethrough from said air inlets across said enclosed heat generating electronic component to said air outlets and said exhaust fan;
• said exhaust fan in operation creating said primary air flow pathway across the non-isolated components between said air inlets and said air outlets in said cabinet housing and exhausting the air to the cabinet exterior, and
• simultaneously creating said separate secondary air flow pathway through said secondary air duct means across said enclosed heat generating component between said air inlets and said air outlets in said cabinet housing and exhausting the secondary air flow to the cabinet exterior, such that
• the non-isolated components and said enclosed heat generating electronic component are independently cooled by the primary air flow pathway and said secondary air flow pathway, respectively, and the heat generated by said enclosed heat generating component and the non-isolated components is not mixed within said cabinet housing to maximize cooling of all components within said cabinet housing.