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US 5,296,734 AGranted
Semiconductor integrated circuit having silicon nitride provided as insulator of capacitor
AssigneeNEC Corporation
InventorMegumi Satoh
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AssigneeNEC Corporation
InventorMegumi Satoh
Estimating the term…
An integrated circuit comprises a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another by a PN junction, an interlayer insulating film formed to substantially cover the principal surface of the substrate, and a capacitor formed in a selected one of the islands and having a dielectric layer which is formed within an opening formed in the interlayer insulating film above the selected island. The dielectric layer is constituted of a multilayer film including a silicon oxide film and a silicon nitride film extending to cover the interlayer insulating film. A power supply line conductor is formed on the interlayer insulating film, and the silicon nitride film is completely removed from a portion of the interlayer insulating film directly under the power supply line conductor.
An integrated circuit comprising a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another, an interlayer insulating film formed to substantially cover said principal surface of said substrate, a capacitor formed in a selected one of said islands and having a dielectric layer which is formed within an opening formed in said interlayer insulating film above said selected island, said dielectric layer including a silicon nitride film, and a power supply line conductor formed on said interlayer insulating film without intermediary of said silicon nitride film, said silicon nitride film extending to cover all the surface of said interlayer insulating film excluding an area under said power supply line conductor.
An integrated circuit comprising a semiconductor substrate, a plurality of islands formed at a principal surface of the substrate and isolated from one another, an interlayer insulating film formed to substantially cover said principal surface of said substrate, a capacitor formed in a selected one of said islands and having a dielectric layer which is formed within an opening formed in said interlayer insulating film above said selected island, said dielectric layer including a silicon nitride film extending to cover said interlayer insulating film, and a power supply line conductor formed on said interlayer insulating film without intermediary of said silicon nitride film, wherein said dielectric layer is formed of a multilayer film including a silicon oxide film and said silicon nitride film, both of which substantially extend to cover said interlayer insulating film, and said power supply line conductor is formed on said interlayer insulating film with intermediary of only said silicon oxide film.
Dependencies are inferred from the claim text.