High value resistive load for an integrated circuit
AssigneeNorthern Telecom Limited
InventorThomas W. MacElwee
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AssigneeNorthern Telecom Limited
InventorThomas W. MacElwee
Estimating the term…
A linear and symmetrical gigaohm resistive load structure for an integrated circuit is implemented using a thin film accumulation mode MOSFET configured as a split gate symmetrically off device. Preferably, the resistive load structure comprises two thin film accumulation mode field effect transistors connected in series with a common node and separate gate electrodes. The thin film devices are provided with undoped or lightly doped polysilicon channel regions to provide a desired gigaohm resistance value. By connecting each of the two gate electrodes to the respective source terminals, a two terminal gigaohm resistor structure is produced in which one of the devices is always in the high impedance OFF state regardless of the terminal voltages. The split gate structure allows the integration of the device with minimal metallization interconnect and only two terminals.
A highly resistive load for an integrated circuit formed on a semiconductor substrate, comprising
An bipolar CMOS integrated circuit formed on a semiconductor substrate and having a highly resistive load structure comprising:
A highly resistive load for a bipolar CMOS integrated circuit formed on a semiconductor substrate comprising:
Dependencies are inferred from the claim text.