Formulation for the activation of substrate surfaces for currentless metallization thereof
AssigneeBayer Aktiengesellschaft
InventorsGunther Reichert, Frank Kobelka, Gerhard-Dieter Wolf, Ulrich von Gizycki
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Abstract
Formulations containing an organometallic activator, a filler, a solvent and an aqueous dispersion of a polyurethane polymer are outstandingly suitable for activation of surfaces of plastics for currentless metallisation thereof. The components of plastic activated in this way are preferably employed, after metallisation has been carried out, for shielding from electromagnetic waves.
Claims8
An activator formulation, for the activation of substrate surfaces for currentless metallisation thereof, consisting of a) 0.03 to 3.0 parts by weight of an organic noble metal, b) 0.5 to 3.0 parts by weight of fillers, c) 10 to 30 parts by weight of an organic solvent and d) 12 to 28 parts by weight of an aqueous dispersion of a polyurethane polymer.
Dependencies are inferred from the claim text.