Method of soldering using a special atmospheric gas
AssigneeOsaka Sanso Kogyo Ltd.
InventorsYoshiharu Tsujimoto, Iku Takenaka, Hiromitsu Onishi, Edward K. Chang
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Abstract
A method of soldering for surface mounting of a printed circuit board, which comprises performing reflow soldering with a rosin-based cream solder in a special atmospheric gas comprising an inert gas such as N.sub.2, Ar or He and containing about 10,000 ppm or less of oxygen and 0.5-3.0% of moisture is disclosed.
Claims3
A method of soldering a packaged printed circuit board, which comprises performing reflow soldering with a rosin-based cream solder in a special atmosphere gas comprising an inert gas and containing no more than about 10,000 ppm of oxygen and 0.5-3.0% of moisture.
A method of soldering, which comprises performing reflow soldering in a special atmospheric gas with the use of a rosin-based cream solder containing a flux with a particularly low solid content, said special atmospheric gas comprising an inert gas and containing no more than about 10,000 ppm of oxygen and 0.5-3.0% of moisture.
Dependencies are inferred from the claim text.