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AssigneeInternational Business Machines Corporation
InventorsSteven P. Young, John Acocella, Albert J. Fahey, Gaetano P. Messina, Seaho Song
Estimating the term…
An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.
A thermal conduction module comprising:
An apparatus for cooling at least one integrated circuit chip mounted on a substrate comprising:
An apparatus for cooling at least one integrated circuit chip comprising:
Dependencies are inferred from the claim text.