Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules

An electronic semiconductor module heat sink for providing direct heat exchange medium contact with a module electrode and possessing a uniform TCE, comprising:

• a) a base having generally a block shape and comprised of a first thermally conductive material, said base containing a sinuous channel therethrough which communicates between inlet and outlet means;
• b) a first place disposed on top of said base and covering said channel, said first plate comprising said module electrode, said module electrode comprising an electrically and thermally conductive element layer direct bonded to a ceramic substrate, said ceramic substrate contacting directly with said sinuous channel such that a plurality of semiconductor chips that are soldered to said top-disposed plate contact, in common, said electrically and thermally conductive element layer of said module electrode and are in thermal communication with said channel through said electrically and thermally conductive element layer and said ceramic substrate;
• and
• c) a second plate disposed on said base opposite said top-disposed plate and comprising a second thermally conductive material which is TCE-compatible with said base and covers said channel opposite said top-disposed plate.