Negative photosensitive composition and method for forming a resist pattern
AssigneeMitsubishi Kasei Corporation
InventorsTameichi Ochiai, Noriaki Takahashi, Tomoyo Ishiguro
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Abstract
A negative photosensitive composition comprising an alkali-soluble resin, a photo-acid-generating material and a crosslinking agent for the alkali-soluble resin, which acts under an acidic condition, wherein the crosslinking agent is a compound of the following formula (I): ##STR1## wherein each of A.sup.1 to A.sup.10 which are independent of one another, is a hydrogen atom, --CH.sub.2 OH or --CH.sub.2 OR, wherein R is C.sub.1 -C.sub.4 linear or branched chain alkyl, and X is C.sub.2 -C.sub.10 linear or branched chain alkylene, provided that at least four among A.sup.1 to A.sup.10 are --CH.sub.2 OR, and a plurality of --CH.sub.2 OR may be the same or different.
Claims14
A negative photosensitive composition comprising an alkali-soluble resin having phenolic hydroxyl groups, a photo-acid-generating material selected from the group consisting of an organic halogen compound, an onium salt and a sulfonic acid ester and a crosslinking agent for the alkali-soluble resin, which acts under an acidic condition, wherein the crosslinking agent is a compound of the following formula (I):
- ##STR4## wherein each of A.sup.1 to A.sup.10 which are independent of one another, is a hydrogen atom, --CH.sub.2 OH or --CH.sub.2 OR, wherein R is C.sub.1 -C.sub.4 linear or branched chain alkyl, and X is C.sub.2 -C.sub.10 linear or branched chain alkylene, provided that at least four among A.sup.1 to A.sup.10 are --CH.sub.2 OR, and a plurality of --CH.sub.2 OR may be the same or different.
A method for forming a resist pattern on a substrate for a semiconductor, which comprises coating on the substrate a negative photosensitive composition comprising an alkali-soluble resin having phenolic hydroxyl groups, a photo-acid-generating material selected from the group consisting of an organic halogen compound, an onium salt and a sulfonic acid ester and a crosslinking agent for the alkali-soluble resin, which acts under an acidic condition, wherein the crosslinking agent is a compound of the following formula (I):
- ##STR5## wherein each of A.sup.1 to A.sup.10 which are independent of one another, is a hydrogen atom, --CH.sub.2 OH or --CH.sub.2 OR, wherein R is C.sub.1 -C.sub.4 linear or branched chain alkyl, and X is C.sub.2 -C.sub.10 linear or branched chain alkylene, provided that at least four among A.sup.1 to A.sup.10 are --CH.sub.2 OR, and a plurality of --CH.sub.2 OR may be the same or different subjecting it to exposure by means of a mercury lamp or excimer laser to copy a pattern, further subjecting it to heat treatment and then developing it with an alkali aqueous solution to form a resist pattern on the substrate.
Dependencies are inferred from the claim text.