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US 5,292,557 AGranted
Electroless plating of substrates
AssigneeAllied-Signal Inc.
InventorLarry D. Olson
Life of this patent
Estimating the term…
Abstract
Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.
Claims10
A method for electroless deposition of copper from solution onto a substrate comprising treating said substrate with an effective amount of a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.
Dependencies are inferred from the claim text.