Sputtering unit

Sputtering unit comprising:

• a) a working chamber (1) of a first predetermined volume including a substrate (4) to be treated by sputtered material;
• b) a first target (2) to be sputtered and being arranged opposite to said substrate (4), said target being connected to a first electrode (3);
• c) an antechamber (5) of a second predetermined volume including at least a second target (7), said second target being connected to a second electrode (6) and further including a door (30) for opening said antechamber (5), said door (30) being arranged opposite said second target (7) and away from said first target (2);
• d) means (8) for separating said working chamber (1) from said antechamber (5) and said substrate (4), said separating means (8) having an opening therein and said first target (2) immerging into said opening, a distance between said separating means (8) and said door (30) being constant when said door is closed;
• e) a third electrode (32) in said antechamber (5), said third electrode being arranged opposite said second target (7) and being electrically connected to said door (30);
• and
• f) means (34-39) for removing said first target (2) from said working chamber (1) and bringing said second target (7) to the place of said first target (2), said removing means comprising means for varying the distance between said first and second targets during their exchange.