Electroless palladium plating composition
AssigneeOkuno Chemical Industries Co., Ltd.
InventorsKuniaki Otsuka, Eiichi Torikai, Shigemitsu Kawagishi, Kazuyoshi Okuno
Life of this patent
Estimating the term…
Abstract
An electroless palladium plating composition which comprises (1) 0.001-0.1 mol/l of a palladium compound, (2) 0.01-1 mol/l of a hypophosphite compound, (3) 0.01-5 mol/l of at least one member selected from the group consisting of ammonia and alkylamine compounds, (4) 0.01-20 mg/l of high-molecular weight polyethyleneimine having molecular weight of 300 to 100000 and (5) 0.01-10 g/l of an aliphatic alkyenylamine, and which is used at a pH in the range of 5-10.
Claims5
An electroless palladium plating composition which comprises (1) 0.001-0.1 mol/l of a palladium compound, (2) 0.01-1 mol/ of a hypophosphite compound (3) 0.01-5 mol/l of at least one member selected from the group consisting of ammonia of alkylamine compounds, (4) 0.01-20 mg/l of high-molecular weight polyethyleneimine having molecular weight of 300 to 100,000 and (5) 0.01-10 g/l of an aliphatic alkylamine, said composition being at a pH in the range of 5-10.
The plating composition as defined in claim wherein the hypophosphite compound is at least one member selected from the group consisting of hypophosphorous acid, ammonium hypophosphite, potassium hypophosphite, sodium hypophosphite, lithium hypophosphite and calcium hypophosphite.
Dependencies are inferred from the claim text.