US 5,292,266 AGranted

Integrated circuit carrier

AssigneeYamaichi Electronics Co., Ltd.

InventorNoriyuki Matsuoka

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Abstract

An electrical conductive pattern is deposited on the surface of a frame constituting an integrated circuit carrier. To enable leads extending from an integrated circuit package to come in contact with the electrical conductive pattern, a plurality of first contact portions are formed on the inner end of the electrical conductive pattern. In addition, to enable a plurality of contact pieces extending from an integrated circuit socket to come in contact with the conductive pattern, a plurality of second contact portions are formed on the outer end of the electrical conductive pattern. Thus, the leads extending from the integrated circuit package are reliably brought into electrical contact with the contact pieces via the first contact portions, the electrical conductive pattern and the second contact portions. The arrangement of the electrical conductive pattern in that way makes it possible that the leads can be spaced from each other at an interval smaller than an interval between adjacent contact pieces.

Claims3

Dependent claims

In an integrated circuit carrier having a frame defining an integrated circuit receiving recess therein and having an inner peripheral surface, an outwardly facing surface, an inwardly facing surface and an outer peripheral surface, a plurality of latch members on said frame adapted to be engaged with and disengaged from an integrated circuit package received in said integrated circuit receiving recess with a plurality of leads extending from the integrated circuit package held on a surface of said frame so that the integrated circuit package is carried by said integrated circuit carrier by said leads;

the improvement comprising:
an electrical conductive pattern on said frame having a plurality of conductor portions spaced around said frame, a plurality of first contact portions on one of said inwardly and outwardly facing surfaces of said frame adjacent said integrated circuit receiving recess for being contacted by corresponding contact ends of said leads extending from an integrated circuit package and each being in electrical contact with one end of a corresponding conductor portion, a plurality of second contact portions on said outer peripheral surface of said frame and each being in electrical contact with the other end of a corresponding conductor portion, said second contact portions being spaced from each other greater distances than said first contact portions;
whereby spring contacts on a socket for receiving said integrated circuit carrier thereon and spaced at larger intervals from each other than the leads on said integrated circuit package can be moved laterally of said outer peripheral surface into and out of contact with said second contact portions for making electrical connection to said integrated circuit package and permitting said integrated circuit carrier to be moved into and out of said socket.

the improvement comprising:
said outer peripheral surface in inclined inwardly toward said integrated circuit receiving recess;
an electrical conductive pattern on said frame having a plurality of conductor portions spaced around said frame, a plurality of first contact portions on one of said inwardly and outwardly facing surfaces of said frame adjacent said integrated circuit receiving recess for being contacted by corresponding contact ends of said leads extending from an integrated circuit package and each being in electrical contact with one end of a corresponding conductor portion, a plurality of second contact portions on said inclined outer peripheral surface of said frame and each being in electrical contact with the other end of a corresponding conductor portion, said second contact portions being spaced from each other greater distances than said first contact portions;
whereby spring contacts on a socket for receiving said integrated circuit carrier thereon and spaced at larger intervals from each other than the leads on said integrated circuit package can be moved laterally of said outer peripheral surface into and out of contact with said second contact portions for making electrical connection to said integrated circuit package and holding said integrated circuit carrier in the socket, and for permitting said integrated circuit carrier to be moved into and out of said socket.

1 more element

the improvement comprising:
an electrical conductive pattern on said frame having a plurality of conductor portions spaced around said frame, a plurality of first contact portions on said inwardly facing surface of said frame adjacent said integrated circuit receiving recess for being contacted by corresponding contact ends of said leads extending from an integrated circuit package and each being in electrical contact with one end of a corresponding conductor portion, a plurality of second contact portions on said outwardly facing surface of said frame adjacent said outer peripheral surface and each being in electrical contact with the other end of a corresponding conductor portion, said respective conductor portions extending along said inwardly facing surface and said outer peripheral surface to respective second contact portions, said second contact portions being spaced from each other greater distances than said first contact portions;
whereby spring contacts on a socket for receiving said integrated circuit carrier thereon and spaced at larger intervals from each other than the leads on said integrated circuit package can be moved laterally of said outer peripheral surface over and downwardly into and out of contact with said second contact portions for making electrical connection to said integrated circuit package and holding said integrated circuit carrier in the socket and for permitting said integrated circuit carrier to be moved into and out of said socket.

Dependencies are inferred from the claim text.