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US 5,290,735 AGranted
Thin, high leadcount package
AssigneeIntel Corporation
InventorKevin J. Haley
Life of this patent
Estimating the term…
Abstract
A high leadcount surface mount IC package. The IC package of the present invention includes a plastic molded compound which is localized over the surface of the die, such that it covers the interconnections of the die. The package includes a leadframe having many leads. The leads are supported using a ring support structure.
Claims23
A method for making a high leadcount surface mount integrated circuit package comprising the steps of:
- providing a leadframe comprised of a plurality of leads, wherein each of the plurality of leads includes a first end, a second end and an intermediate portion between the first end and the second end;
- attaching a permanent support structure to said leadframe, wherein the support structure is attached to the intermediate portion of each of the plurality of leads, such that each of said plurality of leads are held permanently in a predetermined position with respect to the other of said plurality of leads;
- attaching the leadframe to an integrated circuit (IC) die, wherein the first end of each of said plurality of leads is coupled to the die in an interconnect area;
- and
- molding a plastic compound around the die, wherein the plastic compound is localized over the die, such that the plastic compound covers the interrconnect area and does not extend beyond the die and the interconnect area, such that the plastic compound is spaced apart from the support structure.
2 more elements
A method for making a high leadcount surface mount integrated circuit package comprising the steps of:
- providing a leadframe comprised of a plurality of leads, wherein each of the plurality of leads includes a first end, a second end and an intermediate portion between the first end and the second end;
- coupling a permanent support structure to said leadframe, wherein the support structure is coupled to the intermediate portion of each of the plurality of leads and holds the plurality of leads in a single plane, such that each of said plurality of leads are held permanently in a predetermined position with respect to the other of said plurality of leads;
- attaching the leadframe to an integrated circuit (IC) die, wherein the first end of each of said plurality of leads is coupled the die in an interconnect area;
- and
- molding a plastic compound around the die, such that the compound covers the die and is localized over the die and the interconnect area, wherein the plastic compound does not extend beyond the die and the interconnect area and is spaced apart from the support structure, such that a gap along the plurality of leads between the support structure and the plastic compound is created.
2 more elements
A method for making a high leadcount surface mount integrated circuit package comprising the steps of:
- providing a leadframe comprised of a plurality of leads, wherein each of the plurality of leads includes a first end, a second end and an intermediate portion between the first end and the second end;
- coupling a permanent support structure to said leadframe, wherein the support structure is coupled to a part of the intermediate portion of each of the plurality of leads and holds the plurality of leads in a single plane, such that each of said plurality of leads are held permanently in a predetermined position with respect to the other of said plurality of leads, and wherein the support structure extends underneath the die;
- attaching the leadframe to an integrated circuit (IC) die, wherein the first end of each of said plurality of leads is coupled the die in an interconnect area;
- and
- molding a plastic compound around the die, such that the compound covers the die and is localized over the die and the interconnect area, such that a portion of each of the plurality of leads in a space between the plastic compound and the part of the intermediate portion is exposed.
2 more elements
Dependencies are inferred from the claim text.