Process for manufacturing ceramic multilayer substrate
AssigneeNippondenso Co., Ltd.
InventorsTakashi Nagasaka, Hideki Nakagawara
Life of this patent
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Abstract
A ceramic multilayer substrate, containing a stack of alternate ceramic and inner conductor layers, the conductor layer having a melting point higher than a lowest firing temperature of the ceramic layer, the stack having a top ceramic layer, and a conductor layer formed on the stack, the conductor layer being electrically connected to the inner conductor layer, is characterized by further including an insulating layer formed on the top ceramic layer of the stack and under the insulating layer, the insulating layer having a firing temperature lower than the lowest firing temperature of the ceramic layer.
Claims11
A process for manufacturing a ceramic multi-layer substrate, comprising the steps of:
- forming and firing a laminate of alternate ceramic and inner conductor layers at a first firing temperature lower than a melting point of the inner conductor layers by a thick film-forming method, the laminate having a top ceramic layer;
- then forming and firing a glass-containing insulating layer on the top ceramic layer at a second firing temperature lower than said first firing temperature by a thick film-forming method, and
- forming and firing a conductor layer on the insulating layer by a thick film-forming method;
- wherein said conductor layer is electrically connected to one of the inner conductor layers, wherein said glass-containing layer is positioned between said conductor layer and one of said inner conductor layers.
Dependencies are inferred from the claim text.