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US 5,289,349 AGranted
Integrated circuit card
AssigneeSony Corporation
InventorTomoki Nishino
Life of this patent
Estimating the term…
Abstract
Disclosed is an IC card comprising a plurality of semiconductor IC chips and a plurality of lead wires acting as the terminals for connectin,o the electrodes of the semiconductor IC chips to the outside. The semiconductor IC chips and the lead wires are integrally sealed in a plastic board. This construction provides a significantly thin IC card of high reliability at low cost.
Claims3
An integrated circuit card comprising:
- a plurality of semiconductor integrated circuit chips each having a plurality of electrodes;
- and
- a plurality of lead wires acting as the terminals for connecting the electrodes of said semiconductor integrated circuit chips to the outside;
- wherein said semiconductor integrated circuit chips and said lead wires are integrally sealed, without any sub-bases or substrated, in a plastic board.
1 more element
Dependencies are inferred from the claim text.