Radiation-sensitive positive resist composition comprising an o-quinone diazide, an alkali-soluble resin and a polyphenol compound

A positive resist composition comprising, in admixture, a 1,2-quinone-diazide compound, a novolak resin prepared by an addition condensation reaction of a phenol compound with formaldehyde, and a polyphenol compound (I) of the formula:

• ##STR5## wherein R is a C.sub.1 -C.sub.5 alkyl group or a C.sub.1 -C.sub.5 alkoxy group, and n is a number of 0 to 3, wherein said 1,2-quinone diazide compound is prepared by a condensation reaction of 1,2-naphthoquinone diazide sulfonyl chloride or benzoquinone diazide sulfonyl chloride with at least one compound having a hydroxyl group selected from the group consisting of hydroquinone, resorcinol, phloroglucin, 2,4-dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,3,4,4'-tetrahydroxybenzophenone, 2,2', 4,4'-tetrahydroxy-benzophenone, bis(p-hydroxyphenyl)methane, bis(2,4-dihydroxyphenyl)methane, bis(2,3,4-trihydroxyphenyl)methane, 2,2-bis(2,4-dihydroxyphenyl)propane, 2,2-bis(2,3,4-trihydroxyphenyl)propane and hydroxyflavan compounds.