Method for fabrication of thin-film bolometric material
AssigneeThe United States of America as represented by the Secretary of the Army
InventorsDavid A. Jackson, Jr., Samuel M. Tomarchio
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Abstract
A technique for fabrication of thin-film bolometric materials for use in -ohm resistance multi-detector devices. A group IB periodic table element is reactively co-sputtered with small amounts of a dopant in a reduced gas atmosphere. The reactive co-sputtering is achieved in an oxygen containing atmosphere, where the dopant has an oxide that is highly temperature dependent with an electrical resistance that varies in accordance with the oxide content of the dopant. A reduced electrical resistance of the resultant doped material is achieved.
Claims3
A technique for fabrication of thin-film bolometric materials for use in low-ohm multi-detector devices, comprising:
- reactive co-sputtering a group V-B periodic table element or compound in an oxygen containing atmosphere with small amounts of a dopant, where the dopant has an oxide that is highly temperature dependent with an electrical resistance that varies in accordance with the oxide content of the dopant, whereby a change in electrical resistance of the resultant doped material may be achieved by adjusting the oxygen content of the atmosphere during the doping process, wherein the dopant is selected from the group consisting of nickel, iron, cobalt, chromium, tin, and manganese.
Dependencies are inferred from the claim text.