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US 5,288,006 AGranted
Method of bonding tab inner lead and bonding tool
AssigneeNEC Corporation
InventorsYasuhiro Otsuka, Hideki Kaneko
Life of this patent
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AssigneeNEC Corporation
InventorsYasuhiro Otsuka, Hideki Kaneko
Estimating the term…
A bonding tool having a round pointed end smaller than the bonding pad for the semiconductor element is urged with a bonding force F.sub.1 and pressed down into the inner lead of a TAB tape such that the bonding tool end and inner lead come in close contact with each other. Then, the bonding force F.sub.1 applied to the tool is reduced to F.sub.2, while at the same time ultrasonic vibration 17 is applied to the tool, thus effecting bonding of the inner lead to the bonding pad with applied heat and pressure. Unlike the prior art, no bump has to be formed on the bonding pad for the semiconductor element or on an end of the inner lead. It is thus possible to simplify the bonding process and also to reduce the cost of bonding. Further, a highly reliable bond can be realized without causing crack or other damage to the pad structure.
A method of bonding a TAB tape inner lead according to claim 9, wherein a bonding force is applied to said bonding tool when said ultrasonic vibration is applied, with said bonding force being less than another bonding force applied when pressing said bonding tool into said inner lead.
A method of bonding a TAB tape inner lead to a semiconductor element by a single point bonding process, said method comprising the steps of:
Dependencies are inferred from the claim text.