Heat sink plate for multiple semi-conductors
AssigneeAavid Engineering, Inc.
InventorHenry F. Villaume
Life of this patent
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Abstract
A heat sink comprising a thin plate made of a heat conducting material, which plate includes a series of small tapered chimneys extending therethrough, the plate being adapted to fit over and parallel to an entire circuit board, thermally connecting with the semiconductors on the board, the chimneys being spaced inbetween the semiconductors and facilitating natural or forced airflow from the area between the plate and the printed circuit board to the area outside by means of the low pressure drop created by their tapering, the heat sink taking very little vertical space in the electronics package including the printed circuit board while providing effective heat dissipation and shielding from electro-magnetic radiation and/or radio frequency interference for the semiconductors on the board.
Claims6
A heat sink dissipating heat from one or more semiconductors on a printed circuit board comprising:
- a plate having a top surface and a bottom surface,
- said plate being made of heat conductive material and having said bottom surface contacting the semiconductors to be cooled,
- said plate having at least one chimney means, each said chimney means including a tapered sidewall defining a first opening in said plate and a smaller second opening away from said plate, so as to convect heated air from the area adjacent to said bottom surface of said plate to the area adjacent to said top surface,
- attachment means connecting said bottom surface of said plate to the semiconductors so that said plate conducts heat generated by the semiconductors when the semiconductors are in operation, and
- connecting means connecting said plate to a printed circuit board.
Dependencies are inferred from the claim text.