Semiconductor device and video camera unit using it and their manufacturing method

An imaging assembly comprising a plurality of lenses, a solid-state image sensor chip, an insulating substrate attached to said chip and to lead pins, and a holder for incorporating said lenses, said image sensor chip, said insulating substrate and said lead pins so that said lenses, said image sensor chip and said insulating substrate are aligned with one another, wherein said insulating substrate has a side surface formed in a predetermined stepped manner, and wherein said holder has an inner wall formed in a predetermined stepped manner in accordance with the shape of the side surface of said insulating substrate to permit aligning said insulating substrate with said holder in a manner to align said image sensor chip attached to the insulating substrate with said lenses.

An imaging assembly comprising:

• a solid-state imaging sensor chip;
• a plurality of plastic lenses, predetermined ones of which have a non-spherical surface;
• a cylindrical plastic holder containing therein said chip at a lower position and said lenses at an upper position such that said lenses and said chip are aligned with one another, wherein the lower, outer surface of said holder is spread outward compared with the upper, outer surface thereof, further comprising a cylindrical metallic case covering the outer side surface of said holder, wherein the lower, outer surface of said case is spread outward compared with the upper, outer surface thereof.