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US 5,263,991 AGranted
Method for heating biocompatible implants in a thermal packaging line
AssigneeBiomet, Inc.
InventorsRoy C. Wiley, David R. Sarver
Life of this patent
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Abstract
A thermal packaging unit for a biocompatible implant. The thermal packaging unit includes a first compartment for storing the biocompatible implant. In addition, the thermal packaging unit further includes a second compartment which is operable to contain a chemical composition which is able to heat the biocompatible implant by means of an exothermic reaction.
Claims8
A method for heating a preformed biocompatible implant comprising the steps of:
- disposing said preformed biocompatible implant in a thermal packaging unit, said thermal packaging unit including
- (a) means for receiving said biocompatible implant, and
- (b) means for delivering thermal energy to said biocompatible implant upon activation of said thermal packaging unit;
- activating said thermal packaging unit so as to cause said thermal energy to be delivered to said biocompatible implant;
- allowing said biocompatible implant to be heated to a temperature where said biocompatible implant becomes deformable;
- and
- removing said biocompatible implant from said thermal packaging unit after said biocompatible implant becomes deformable.
4 more elements
Dependencies are inferred from the claim text.