Low VOC (volatile organic compounds), solvent-based thermoplastic pipe adhesives which maintain joint adhesive performance
OwnerNaresh D. Patel, Mark W. Browninventors
Life of this patent
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Abstract
A low volatile organic compound emitting thermoplastic pipe adhesive includes a resin, one or more solvents, a low specific gravity filler such as hollow ceramic spheres and a thixotropic agent for maintaining the homogeneity of the adhesive mixture.
Claims21
A thermoplastic pipe adhesive mixture comprising:
- a) at least one resin either (1) selected from the group consisting of polyvinylchloride, chlorinated polyvinylchloride, and acrylic or (2) consisting essentially of acrylonitrile-butadiene-styrene;
- b) a solvent blend comprising either (i) a primary solvent consisting essentially of tetrahydrofuran and at least one secondary solvent of lesser amount selected from the group consisting of 1,1,1-trichloroethane, methylene chloride, cyclohexanone, N-methyl-2-pyrrolidone, methyl ethyl ketone, acetone, and dimethyl formamide for use with the group (1) resin or (ii) a primary solvent consisting essentially of methyl ethyl ketone and optionally at least one secondary solvent of lesser amount selected from the group consisting of 1,1,1-trichloroethane, methylene chloride, cyclohexanone, N-methyl-2-pyrrolidone, and acetone for use with the group (2) resin;
- c) a low specific gravity filler consisting essentially of hollow ceramic spheres;
- and
- d) a thixotropic agent for maintaining the homogeneous nature of the mixture.
A low vapor pressure thermoplastic adhesive consisting essentially of:
- a) one or more resins selected from the group consisting of polyvinylchloride, chlorinated polyvinylchloride, acrylonitrile-butadiene-styrene, and ACRYLIC;
- b) one or more solvents selected from the group consisting of N-methyl-2-pyrrolidone, cyclohexanone, tetrahydrofuran, methyl ethyl ketone, and dimethylformamide;
- c) a thixotropic agent for maintaining homogeneous nature of the mixture;
- and
- d) a low specific gravity filler consisting essentially of hollow ceramic spheres.
A low vapor pressure thermoplastic adhesive comprising:
- a) one or more resins selected from the group consisting of polyvinylchloride, chlorinated polyvinylchloride, acrylonitrile-butadiene-styrene, and ACRYLIC;
- b) one or more solvents selected from the group consisting of N-methyl-2-pyrrolidone, cyclohexanone, tetrahydrofuran, methyl ethyl ketone, and dimethylformamide;
- and
- c) a low specific gravity filler consisting essentially of hollow ceramic spheres.
A thermoplastic pipe adhesive mixture comprising:
- a) a resin mixture comprising acrylic and a resin selected from the group consisting of polyvinylchloride and chlorinated polyvinylchloride;
- b) a solvent blend consisting essentially of tetrahydrofuran, cyclohexanone, and methyl ethyl ketone;
- and
- c) a low specific gravity filler consisting essentially of hollow ceramic spheres.
A thermoplastic pipe adhesive mixture comprising:
- a) at least one resin either (1) selected from the group consisting of polyvinylchloride, chlorinated polyvinylchloride, and acrylic or (2) consisting essentially of acrylonitrile-butadiene-styrene;
- b) a solvent blend comprising a primary solvent consisting essentially of at least one of n-methyl-pyrrolidone and cyclohexanone and at least one secondary solvent of lesser amount comprising at least one solvent selected from the group consisting of tetrahydrofuran and methyl ethyl ketone;
- and
- c) a thixotropic agent for providing optimum flow properties of the mixture.
A method for reducing volatile organic compound emissions from thermoplastic pipe adhesives, comprising formulating said adhesive by combining
- a) at least one resin either (1) selected from the group consisting of polyvinylchloride, chlorinated polyvinylchloride, and acrylic or (2) consisting essentially of acrylonitrile-butadiene-styrene;
- b) a solvent blend comprising either (i) a primary solvent consisting essentially of tetrahydrofuran and at least one secondary solvent of lesser amount selected from the group consisting of 1,1,1-trichloroethane, methylene chloride, cyclohexanone, N-methyl-2-pyrrolidone, methyl ethyl ketone, acetone, and dimethyl formamide for use with the group (1) resin or (ii) a primary solvent consisting essentially of methyl ethyl ketone and optionally at least one secondary solvent of lesser amount selected from the group consisting of 1,1,1-trichloroethane, methylene chloride, cyclohexanone, N-methyl-2-pyrrolidone, and acetone for use with the group (2) resin;
- c) a low specific gravity filler consisting essentially of hollow ceramic spheres;
- and
- d) a thixotropic agent for maintaining the homogenous nature of the mixture.
A method for reducing volatile organic compound emissions from thermoplastic pipe adhesive mixtures, comprising formulating said adhesive by combining:
- a) a resin mixture comprising acrylic and a resin selected from the group consisting of polyvinylchloride and chlorinated polyvinylchloride;
- b) a solvent blend comprising tetrahydrofuran, cyclohexanone, and methyl ethyl ketone;
- and
- c) a low specific gravity filler comprising hollow ceramic spheres.
A method for reducing volatile organic compound emissions from thermoplastic pipe adhesive mixtures, comprising formulating said adhesive by combining:
- a) at least one resin either (1) selected from the group consisting of polyvinylchloride, chlorinated polyvinylchloride, and acrylic or (2) consisting essentially of acrylonitrile-butadiene-styrene;
- b) a solvent blend comprising a primary solvent consisting essentially of at least one of n-methylpyrrolidone and cyclohexanone and at least one secondary solvent of lesser amount, comprising at least one solvent selected from the group consisting of tetrahydrofuran and methyl ethyl ketone;
- and
- c) a thixotropic agent for providing optimum flow properties of the mixture;
- and
- d) a low specific gravity filler consisting essentially of hollow ceramic spheres.
Dependencies are inferred from the claim text.