VLSI memory with increased memory access speed, increased memory cell density and decreased parasitic capacitance
AssigneeCreative Integrated Systems, Inc.
InventorJames A. Komarek
Life of this patent
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AssigneeCreative Integrated Systems, Inc.
InventorJames A. Komarek
Estimating the term…
The performance of a Very Large Scale Integrated Read-Only Memory Circuit is improved by providing an architecture for columns of memory cells so that a signal from an addressed memory cell need propagate on diffusion bit lines by a distance approximately equal to the length of the diffusion bit line within a single block of memory cells. The architecture of the memory layout is improved by providing bit line and virtual ground line contacts at opposing ends of the memory block and by replicating the memory block through mirror symmetry on the semiconductor substrate. The memory array is further improved by providing bank selection transistors for each bank at each opposing end of a memory block so the propagation signal of an addressed memory cell need only travel the length of a single bit diffusion line in the bank.
An improvement in a memory circuit having an array of addressable memory cells organized into blocks of memory cells and including a plurality of diffusion bit lines, diffusion virtual ground lines and a diffusion main bit line, each of said diffusion bit lines, diffusion virtual ground lines and diffusion main bit line longitudinally disposed through said blocks of memory cells, each of said blocks having a first and second end, said diffusion bit lines, virtual ground lines and main bit line disposed between said first and second end of each of said blocks, said improvement comprising:
An improvement in a memory circuit having a plurality of addressable memory cells arranged in a plurality of blocks, each block of said plurality of memory cells being logically organized in columns, said columns of memory cells being coupled together by diffusion bit lines, said memory block being provided with at least one diffusion virtual ground line and a diffusion main bit line which with said diffusion bit lines define a length of said block, said block having opposing ends at opposite ends of said length, said plurality of blocks being coupled together at their ends by metalization lines, said improvement comprising:
An improvement in a memory comprised of a plurality of memory blocks coupled together through metalization lines at each end of each block so that each block is accessed from its ends independently of each other block, each block comprising a plurality of addressable memory cells arranged in logical columns, each column having two corresponding diffusion bit lines disposed along the length of said block of memory cells, said memory cells arranged and configured into four columns with a main diffusion bit line between said second and third columns of memory cells, said improvement comprising:
A method for accessing a memory circuit having an array of addressable memory cells organized into blocks of memory cells and including a plurality of diffusion bit lines, virtual ground lines and a main bit line, each of said diffusion bit lines, virtual ground lines and main bit line longitudinally disposed through said blocks of memory cells, each of said blocks having a first and second end, said diffusion bit lines, virtual ground lines and main bit line disposed between said first and second end of each of said blocks, said method comprising the steps of:
A method for accessing a memory circuit having a plurality of addressable memory cells arranged in a plurality of blocks, said plurality of memory cells in each block being logically organized in columns, said columns of memory cells being coupled together by diffusion bit lines, at least one virtual ground line and a main bit line, said blocks being coupled together by metalization lines and being selectively coupled to ground and a sense amplifier by said metalization lines, said method comprising the steps of:
A method for accessing a memory comprising a plurality of addressable memory cells arranged in logical columns to form a plurality of blocks of memory cells, each block being coupled by metalization lines with each one of said other blocks and being selectively coupled through said metalization lines to ground and a sense amplifier, each column having two corresponding diffusion bit lines disposed along the length of said block of memory cells, said memory cells arranged and configured into four columns with a main diffusion bit line corresponding to said second and third columns of memory cells, said memory cells being coupled to said diffusion bit lines, said method comprising the steps of:
Dependencies are inferred from the claim text.