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AssigneeTosoh SMD, Inc.
InventorsJohn J. Mueller, David E. Stellrecht
Estimating the term…
Methods of preparing a sputter target/backing plate assembly and assemblies so prepared are disclosed. The methods comprise forming a plurality of grooves in one of the metal surfaces to be joined in the bonding process. The grooves are each provided in a closed, loop configuration or pattern. The target and backing plate to be bonded are adjacently positioned to form an assembly with the grooved surface forming one of the interfacial joint surfaces. The assembly is then placed in a controlled atmosphere, such as a vacuum, heated to a temperature just below the melting point of the lower melting metal to be joined, and pressed until the grooves are substantially filled with metal or alloy from the other, non-grooved interfacial surface.
In a method of preparing a bonded sputter target/backing plate assembly comprising a target composed of a first metal or alloy to be sputtered and an underlying backing plate member composed of a second metal or alloy, an improved method for joining said target and backing plate along mating surfaces thereof, comprising:
Dependencies are inferred from the claim text.