Lead conditioner for Quad semiconductor packages

An offset conditioner for correctly positioning quad-package leads, said conditioner presenting a substantially upright z axis and x and y axes defining a plane substantially perpendicular to the z axis, said offset conditioner comprising:

• a nest;
• a straightening die operatively coupled with and shiftable on either the x or y axis relative to said nest, said die having four sets of blades suitable for enmeshment with the quad leads;
• and
• a cam operatively coupled with said die for shifting thereof on either the x or y axis relative to said nest.

A planarity conditioner for correctly positioning quad-package leads, said planarity conditioner comprising:

• a lower shoe die including a nest and a frame,
• said frame including fixed straightening portions surrounding said nest, said nest downwardly shiftable and upwardly spring-biased;
• an upper shoe die operatively coupled with said lower shoe die and including an upwardly-biased plunger and a planarizing surface,
• said plunger downwardly shiftable relative to said frame;
• and
• a working air cylinder coupled with said plunger.

A lead conditioning system adapted for use on a quad semiconductor package having a plurality of quad-package leads presenting offset spacings therebetween, said system presenting a substantially upright z axis and x and y axes defining a plane substantially perpendicular to the z axis, said system further presenting a collective planarity, the planarity substantially characterized in or about the plane defined by the x and y axes, said system comprising:

• a transport assembly suitable for conveying quad semiconductor packages;
• an offset conditioner coupled to said transport assembly, said offset conditioner including--
• a nest,
• a straightening die operatively coupled with and shiftable on either the x or y axis relative to said nest, said die having four sets of blades suitable for enmeshment with the quad leads, and
• a cam operatively coupled with said die for shifting thereof on either the x or y axis relative to said nest;
• a planarity conditioner coupled to said transport assembly, said planarity conditioner including--
• a lower shoe die including a nest and a frame,
• said frame including fixed straightening portions surrounding said nest, said nest downwardly shiftable and upwardly spring-biased,
• an upper shoe die operatively coupled with said lower shoe die and including an upwardly-biased plunger and a planarizing surface,
• said plunger downwardly shiftable relative to said frame, and
• a working air cylinder coupled with said plunger;
• an electronic controller coupled to and electronically controlling said transport assembly, said offset conditioner and said planarity conditioner so that said transport assembly is capable of conveying quad semiconductor packages to said offset conditioner and to said planarity conditioner and so that said offset conditioner and said planarity conditioner are capable of correctly adjusting the offset spacing and planarity spacing of the quad-package leads.

A method for accurately centering semiconductor devices, said method comprising the steps of:

• providing a self centering device having--
• an engagement tool presenting a length slightly less than the length of the semiconductor device, and
• a plurality of centering blades, each respectively, extendibly fixed to said side of said engagement tool,
• said blades extending downwardly below said lower surface of said centering tool;
• engaging said lower surface of said centering tool with the upper surface of the body of the device, so that said blades are shifted to said extended position, whereby said blades center the device.

A method of conditioning a quad semiconductor package having a plurality of quad-package leads presenting offset spacings and a planarity therebetween, said method comprising the steps of:

• providing a blade unit having four sets of blades suitable for enmeshment with the quad leads, said blade unit presenting an x-y plane and a center position therein;
• enmeshing said blades with the leads;
• shifting said blades in all four directions of the x-y plane and returning to the center position so as to cause the leads to be shifted whereby the offset spacing of the leads conforms to a predetermined specification;
• manipulating the package so that the leads present an essentially upright profile;
• and
• depressing the tips of the leads so that the leads present an oblique-angle profile and the lead tips are essentially coplanar.