Phenol formaldehyde steam pressing of waferboard

A process of producing, from particulate lignocellulosic material, a consolidated product having an average internal bond strength of at least 85 psi, comprising drying said material, applying liquid phenol formaldehyde resin having a resin solids content of at least 35% by weight on the surface of said material, applying a dry phenol formaldehyde resin to said material, then forming a layup from said material having said resins applied thereto, coordinating said drying and said application of liquid resin to ensure said layup has a moisture content of no more than 7% based on the oven dry weight of the material and steam pressing said layup at elevated temperature and pressure sufficient to set or cure said resins and consolidate said layup into said product.