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US 5,212,626 AGranted
Electronic packaging and cooling system using superconductors for power distribution
AssigneeInternational Business Machines Corporation
InventorsDavid F. Bell, Bruno R. Pagnani, James R. Warnot, Jr.
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Abstract
A board containing plural superconducting power planes, one for each required potential level, is used to distribute power to one or more semiconductor logic chips which, together with the board, are immersed in liquid nitrogen. Each chip is coupled thermally to a heat exchanger and is coupled electrically to the board through leads that minimize heat transfer from the chip to the board.
Claims8
An electronic packaging system comprising:
- a sealed enclosure containing an internal cavity;
- cooling means for maintaining a temperature within said internal cavity below a critical superconductive temperature, said cooling means connected to said sealed enclosure;
- an interconnection board having at least one power plane, said power plane comprising a material that is superconductive below said critical superconductive temperature, said interconnection board disposed within said internal cavity of said sealed enclosure;
- at least one power supply bus connected to said at least one power plane, said at least one power supply bus extending through a sealed opening in said sealed enclosure and supplying an electrical potential to said at least one power plane;
- at least one semiconductor logic chip;
- mounting means mounting said logic chip in said cavity in a position offset from said interconnection board, said mounting means electrically connecting said power plane of said interconnection board to said logic chip;
- and
- thermal isolation means connected between said chip and said interconnection board for preventing heat transfer from said semiconductor logic chip to said interconnection board.
5 more elements
Dependencies are inferred from the claim text.