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US 5,211,324 AGranted
Composite boat transport providing clipless securement of semiconductor device assembly to boat transport, and of lid to package body
AssigneeLSI Logic Corporation
InventorWallace A. Fiedler
Life of this patent
Estimating the term…
Abstract
A magnet is disposed in proximity to an un-lidded semiconductor package being assembled. When a ferrous lid is placed over the package opening, the magnetic field holds the lid in place, and also holds the package on an assembly boat carrying the package through an oven for hermetic sealing.
Claims5
Composite boat transport for supporting semiconductor packages during assembly, comprising:
- a planar platform member having a top surface and a support area on the top surface for supporting a semiconductor package body;
- a loader member having a top surface for supporting the planar platform member;
- and
- a magnet mounted to the loader member at a location where the magnet will exert a force holding a lid onto the semiconductor package body.
1 more element
Boat transport for supporting semiconductor packages during assembly, comprising:
- a platform having a top surface and an area for supporting a semiconductor package body;
- and
- a magnet associated with the platform for exerting a force holding a lid onto the semiconductor package body.
Dependencies are inferred from the claim text.